Cmp Polishing Slurry Pad Consumables Keyword Candidate Study
Cmp Polishing Slurry Pad Consumables Keyword Candidate Study. A count note for 2 archive records, dated 2026-10-16: labels, existing excerpts and record links, without stable rankings.
Revision and archive snapshot: 2026-10-16
Swipe tables sideways to see all columns.
Research findings
Small-cohort observation
This filter matches 2 archive records. Beijing Jingyi Jingwei Technology Co., Ltd. (Beijing / Advanced materials); Anji Microelectronics Technology (Shanghai) Co., Ltd. (Shanghai / Next-generation information technology).
Company cohort
Directly linked pages
Share of public archive
Archive date
2
2
0.0%
2026-10-16
Deduplicated company IDs.
Counts within parent sets
Set
All records
This subset
Excluding this subset
All public archive records
19,297
2
19,295
Observed labels
Dimension
Label
Count/base
Participation
reporting jurisdiction
Shanghai
1/2
50.0%
reporting jurisdiction
Beijing
1/2
50.0%
industry
Next-generation information technology
1/2
50.0%
industry
Advanced materials
1/2
50.0%
Multi-label counts can overlap; filter compliance is not industrial advantage.
Evidence and list-linkage counts
Measure
Count
Companies with existing sourced excerpts
1/2
Existing reviewed bilingual excerpt pairs
1
IDs linked to 2026 local lists
1/2
Existing excerpts do not certify entire old reports; list linkage is not final recognition. Full definitions are on the series page.
How candidates match
Field
Matches/candidates
Name
0/2
Product field
1/2
Sub-industry
1/2
Fields can overlap; hits establish search relevance only.